Factory Tour
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Automatic Laminating Line
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Plating Line
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Drilling Machine
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Clean Room
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Punching Mechine
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X-Ray Targeting Mechine
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PTH Line
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Dry Film
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Etching Line
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Exposure Machine
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UV LED Exposure
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CCD Semi-automatic Exposure Machine
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Automatic Solder-Mask Machine
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Scrubbing Line
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Silkscreen Printing
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Scrubbing Line
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ENIG Line
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ENIG Line
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ENIG Line Pre-treatment Line
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CNC V-cut Machine
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Developing Line
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Routing Machine
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Pre-treatment Line
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Oven
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Material |
Supply Name |
|
Base Material |
FR-4, CEM-3: KingBoard, ShengYi, NanYa, Grace Aluminium: Bergquist Special: ISOLA, ROGER...etc. |
|
Copper |
Shigangxing |
|
Tin |
Yunnan Tin |
|
Inner Layer |
Taiyo |
|
Soldermask |
Taiyo |
|
Legend |
Taiyo |
|
Photoimageable etching resist ink |
Peters |
|
Brown film |
FOLEX |
|
Photo film |
Yacoo |
| *** Other brands of material are available upon request. | |
Capabilities
|
Items
|
Specification
|
|
Maximum Layer Count
|
24 Layers
|
|
Finished Board Thickness
|
16mil ~ 128mil (0.4mm ~3.2mm)
|
|
Maximum Dimension
|
20" x 24" (508mm x 610mm)
|
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Minimum Line Width / Spacing
|
4mil / 4mil (0.1mm / 0.1mm)
|
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Minimum Mechanical Hole Diameter
|
10mil (0.25mm)
|
| Minimum Laser Hole Diameter |
4mil (0.1mm)
|
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Minimum Solder PAD Diameter
|
10mil (0.25mm)
|
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Hole Position Presision
|
2mil (0.05mm)
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Minimum Hole to Hole Spacing
|
12mil (0.3mm)
|
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Minimum Hole to Edge Spacing
|
8mil (0.2mm)
|
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Surface Treatment
|
HAL, Lead Free HAL, Flash Gold, ENIG, OSP, Imm. Siliver, Imm. Tin
|
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Minimum Hole Wall Thickness
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>18um
|
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Maximum Aspect Ratio
|
8.0 : 1
|
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Minimum Annular Ring
|
4.5mil (0.115mm)
|
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Maximum Thickness of Wiring
|
Inner Layer: 3oz, Outer Layer:4oz
|
|
Minimum Height of Characters
|
32mil (0.8mm)
|
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Minimum Size of Punched Hole
|
0.1" (2.5mm)
|
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Controlled Impedance
|
+/- 10%
|
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Outline Precision (CNC)
|
4mil (0.1mm)
|
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Outline Precision (Punch)
|
2mil (0.05mm)
|
|
HDI Construction
|
BVH/ Build up/ 1+N+1/ 2+N+2
|
News
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